Optical metrology is the study of physical surface properties like dimensions, flatness, curvature, roughness, and so on. These can be determined through a variety of contact or non-contact methods and are non-destructive in nature. They can be used to determine whether an optical component will perform according to its specifications.
Optical metrology in its various forms is often the best method for improving automation because it is faster than other methods. Optical methods also have the advantage of measuring without marking or deforming delicate surfaces, such as auto body sheet metal, composite parts, or delicate surgical implants. Another case in point is the use of metrology devices to precisely move robots, increasing their location accuracy from a few millimeters to 100 m or better.
Process control – An important metrological part
The ability to read different CAD file formats, as well as the programming flexibility to quickly measure a wide range of aperture sizes, shapes, and placements, as well as monitoring for clogged/missing apertures, are critical metrology requirements for stencil process control. The goal of Process Control Metrology is to be the industry leader in client service, precision alignment training, and field consultation services. We aim to go above and beyond industry standards by providing excellent and affordable services. This is accomplished by providing insightful advice, taking appropriate action, communicating clearly and on time, and providing detailed documentation to support your operations.
A compact, high accuracy dimensional metrology - die shift measurements
A compact, high-accuracy dimensional metrology system with adaptable optics and lighting, as well as cutting-edge edge detection and image processing capabilities, is required due to the variety of die types, dimensions, and placements, as well as die shift measurements, reflection, and texture changes between die and substrate surfaces. Furthermore, to achieve the required balance of accuracy and throughput, different stage sizes and high-precision movements may be required. Die Shift Measurement is suitable for a wide range of parts, including molded plastic parts, machined parts, electronic assemblies, semiconductor packages, fiber optic components, disc media substrates, recording head dies, and semiconductor wafers up to 150 mm in diameter.
What is multi – chip modules? – die location measurements
The inspection of multi-chip modules (MCM) can frequently present particularly difficult metrology requirements due to the need to precisely control numerous different factors for multiple die on a common substrate, such as die location measurement, die height at the corners, verification of wire counts for each die, and die-to-substrate alignment characteristics.
The final wrapping
View measurement machines will continue to improve the speed, precision, and resolution of optically-based systems used for metrology applications in manufacturing automation. View vision Measurement Machines provides our clients with high-quality, individualized solutions that improve product quality, reduce production errors, and reduce manufacturing costs.
ViewMM will continue to pioneer and advance the speed, accuracy, and resolution of optically-based systems used in manufacturing automation metrology applications. With high quality, customised solutions, ViewMM provides our customers with systems that improve product quality, eliminate production errors, and reduce manufacturing costs.
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