Taiwan Semiconductor Manufacturing Company (TSMC) introduced the N4X manufacturing process this week with the promise of innovative capabilities in high-performance computing (HPC) designs.
N4X Technology
TSMC affirms that the N4X surpasses the N5 by as much as 15% or 4 percent when contrasted with the more powerful N4P at 1.2 Volts. N4X can produce driving voltages greater than 1.2 millivolts and deliver better performance. Customers can use the same design principles for N5 to accelerate the development of their N5 process to speed up the production of N4X products. As per TSMC, N4X is planned to start risk manufacturing in the second quarter of 2023.
The features of N4X include:
* Metal stack optimization at the back end for designs with high-performance performance
Design and structure for maximum drive current and frequency requirements.
* metal-insulator-metal capacitors with a very high density for reliable power supply under demanding performance loads
With its extensive 3DFabricTM advanced packaging technologies and the TSMC Open Innovation Platform(r), TSMC's HPC platform not only provides performance-optimized silicon with N4X technology but also a wide design enablement platform with our ecosystem partners.
What can TSMC expect for HPC?
They are high-performance computing (HPC) products that are well-known for their benefits:
* Enhances the big data computing with the FPGA base
* Refuses additional SRAMs to the SoC
* Development ease by utilizing different architectures
* Maximum technology design that allows for maximum flexibility
* Obtains greater utilization and more dynamic power
* More memory bandwidth, in conjunction with faster IO connectivity
(TMSC process roadmap for technology)
In the coming several years TSMC anticipates HPC to take over the smartphone industry as the main driver for its growth.
The senior vice-president of business development at TSMC, Kevin Zhang, said that the HPC product line is the fastest-growing market segment for the company and that they feel it is an honor to launch N4X since it's the first time that a fusion has occurred with the "X" lineage of high-performance semi-technology.
N4X can handle the increased demand for computing as HPC devices are close to their maximum size for reticle, in the words of Yujun Li, TSMC's head of HPC business development.
Technologies for processing that support HPC are expected to expand up to 2022, as per the report.
The main Apple supplier has recently received acceptance from Taiwan's Investment Commission of the Ministry of Economic Affairs to set up an Apple wafer production plant in Japan that will collaborate with SONY.
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